Circuit and method for reducing leakage current in a row driver circuit in a flash memory during a standby mode of operation

ABSTRACT

A row driver receives an input signal and a test mode signal, and is coupled to first and second voltage sources and has an output coupled to a word line. The row driver operates in an active mode responsive to the test mode signal going inactive to couple the output to either the first or second voltage source responsive to the input signal. The row driver operates in a standby mode responsive to the test mode signal going active to present a high impedance to the word line. A method includes detecting a first mode of operation of a memory device and floating at least some of the word lines when the first mode is detected. The memory device may be a flash memory device and the first mode may be a standby mode of operation of the flash memory device.

TECHNICAL FIELD

The present invention relates generally to integrated circuits, and morespecifically to lowering power consumption in integrated circuits duringcertain modes of operation.

BACKGROUND OF THE INVENTION

Many battery-powered portable electronic devices, such as laptopcomputers, Portable Digital Assistants, digital cameras, cell phones andthe like, require memory devices that provide large storage capacity andlow power consumption. One type of memory device that is well-suited touse in such portable devices is flash memory, which is a type ofsemiconductor memory that provides a relatively large nonvolatilestorage capacity for data. The nonvolatile nature of the storage meansthat the flash memory does not require power to maintain the data, aswill be appreciated by those skilled in the art.

A typical flash memory comprises a memory-cell array having an array ofmemory cells arranged in rows and columns and grouped into blocks. FIG.1 illustrates a conventional flash memory cell 100 formed by a fieldeffect transistor including a source 102 and drain 104 formed in asubstrate 106, with a channel 108 being defined between the source anddrain. Each of the memory cells 100 further includes a control gate 110and a floating gate 112 formed over the channel 108 and isolated fromthe channel and from each other by isolation layers 114. In thememory-cell array, each memory cell 100 in a given row has its controlgate 110 coupled to a corresponding word line WL and each memory cell ina given column has its drain 104 coupled to a corresponding bit line BL.The sources 102 of each memory cell 100 in a given block are coupledtogether to allow all cells in the block to be simultaneously erased, aswill be appreciated by those skilled in the art.

The memory cell 100 is charged or programmed by applying appropriatevoltages to the source 102, drain 104, and control gate 110 and therebyinjecting electrons e⁻from the drain 104 and channel 108 through theisolation layer 114 and onto the floating gate 112. Similarly, to erasethe memory cell 100, appropriate voltages are applied to the source 102,drain 104, and control gate 110 to remove electrons e⁻through theisolation layer 114 to the source 102 and channel 108. The presence orabsence of charge on the control gate 112 adjusts a threshold voltage ofthe memory cell 100 and in this way stores data in the memory cell. Whencharge is stored on the floating gate 112, the memory cell 100 does notturn ON when an access voltage is applied through the word line WL tothe control gate 110, and when no charge is stored on the floating gatethe cell turns ON in response to the access voltage. In this way, thememory cell 100 stores data having a first logic state when the cellturns ON and a second logic state when the cells does not turn ON.

In a conventional flash memory, a row driver is coupled to each wordline WL in the memory-cell array and operates to access memory cells 100in the corresponding row in response to activation signals. FIG. 2illustrates a conventional row driver 200 including a PMOS drivetransistor 202 and NMOS drive transistor 204 coupled in series, with asupply voltage VX and a first reference voltage VXGND being applied tothe sources of the PMOS drive transistor and NMOS drive transistor,respectively. The interconnection of the drains of the transistors 202and 204 define a node 206 that is coupled to a corresponding word lineWL. A second PMOS transistor 208 and NMOS transistor 210 are coupled inseries, with the supply voltage VX and a second reference voltageXPDACOM being applied to the sources of the transistors, respectively.The interconnection of the drains of the transistors 208, 210 defines anode 212 that is coupled to the gates of the drive transistors 202 and204. The transistor 210 receives a first activation signal XPDA and thePMOS transistor 208 receives a second activation signal VXDECEN#.Typically, the first and second reference voltage VXGND and XPDACOM areground while the supply voltage VX is 5 volts.

In operation, the row driver 200 operates in a select mode to activatememory cells 100 (not shown in FIG. 2) coupled to the word line WL andoperates in a deselect mode to turn OFF or deactivate memory cellscoupled to the word line, as will now be explained in more detail. Inthe select mode, the VXDECEN# and XPDA signals are high, turning OFF thePMOS transistor 208 and turning ON the NMOS transistor 210,respectively. The node 212 is driven low through the transistor 210,turning OFF the drive transistor 204 and turning ON the drive transistor202 which, in turn, drives the word line WL high to approximately thesupply voltage VX through the transistor 202. At this point, the memorycells 100 (see FIG. 1) coupled to the word line WL either turn ON orremain OFF, depending on whether a memory cell has been programmed orerased (i.e., depending on the data stored in the cell). In this way,address decode circuitry (not shown) in the flash memory containing therow driver 200 activates the XPDA signal corresponding to the row ofmemory cells to be accessed. In response to the activated XPDA signal,the corresponding row driver 200 drives the word line WL high to therebyaccess the memory cells 100 in the corresponding row.

In the deselect mode, the VXDECEN# and XPDA signals are low, turning ONthe PMOS transistor 208 and turning OFF the NMOS transistor 201,respectively. The node 212 is driven high through the transistor 208,turning OFF the drive transistor 202 and turning ON the drive transistor204 which, in turn, drives the word line WL low to approximately groundthrough the transistor 204. At this point, all the memory cells 100coupled to the word line WL are turned OFF, regardless of whether a cellhas been programmed or erased. Each row driver 200 operates in thedeselect mode when the corresponding row of memory cells 100 is notbeing accessed.

During normal operation of the flash memory, each row driver 200alternately operates in either the select or deselect mode, depending onwhether the corresponding row of memory cells 100 is being accessed ornot. The normal mode includes operation of the flash memory during datatransfers and when memory cells are being programmed and erased. All therow drivers 200 operate in the deselect mode during a sleep orpower-savings mode of operation of the flash memory. As previouslymentioned, many battery-powered portable electronic devices utilizeflash memory, and to reduce the power consumption and thereby extend thebattery life in such devices, the flash memory is typically placed inthe power-savings mode when the flash memory is not being used. When inthe power-savings mode, the row driver 200 operates as previouslydescribed to drive the word line WL low and deactivate all thecorresponding memory cells 100.

When a flash memory is operating in the power-savings mode, the memorywill at some point be activated to commence data transfer operations inthe normal mode. For example, in a portable device the flash memory maybe operate in the power-savings mode when the device is turned OFF, andbe activated in response to a user turning ON the device. The timerequired to switch from the power-savings mode to the active mode isideally minimized so that a user does not experience a delay due to theflash memory changing modes of operation. Thus, the flash memory shouldbe able to begin transferring data to and from the memory cells 100 assoon as possible after termination of the power-savings mode. As aresult, during the power-savings mode, a charge pump (not shown) thatdevelops the supply voltage VX continues operating to provide the supplyvoltage VX to the row drivers 200. In this way, when the power-savingsmode is terminated, a selected row driver 200 may activate thecorresponding word line WL more quickly than if the driver needed towait for the charge pump to generate the supply voltage VX having therequired magnitude.

Ideally, operation of the charge pump during the power-savings modeconsumes no power since all the row drivers 200 are driving the wordlines WL low and the PMOS drive transistors 202 are turned OFF, aspreviously described. More specifically, during the power-savings mode,the VXDECEN# and XPDA signals are low, driving the node 212 high throughthe transistor 208 and thereby turning OFF the PMOS drive transistor202. Due to the voltages applied to the source, drain, and gate of thePMOS drive transistor 202, however, a gate induced drain leakage (GIDL)current IGIDL flows through the PMOS drive transistor, as will beappreciated by those skilled in the art. FIG. 3 is a simplifiedcross-sectional view of the PMOS drive transistor 202 illustrating theIGIDL current through the transistor in this situation. A high electricfield is developed in an area 300 where the gate 302 overlaps the drain304 of the PMOS drive transistor 202. The high electric field is due tothe supply voltage VX being applied to the gate 302 and ground beingapplied to the drain 304 and generates the IGIDL current. The concept ofa gate induced drain leakage current is understood by those skilled inthe art, and thus, for the sake of brevity, will not be discussed inmore detail.

During the power-savings mode, the NMOS drive transistor 204 is turnedON in response to the node 212 (FIG. 2) being driven high through thetransistor 208. As a result, the IGIDL current flows through the PMOSdrive transistor 202 and through the NMOS drive transistor 204 to groundin each row driver 200. While the IGIDL current through an individualPMOS transistor 202 in a single row driver 200 is small, the summationof the IGIDL currents through all the row drivers may be relativelylarge, and can cause the charge pump developing the supply voltage VX toconsume a significant amount of power during the power-savings mode ofoperation. The total current consumed by the charge pump will actuallybe substantially greater than the summation of the leakage currentsIGIDL through the row drivers 200 due to operating inefficiencies of thecharge pump, as will be appreciated by those skilled in the art.

There is a need for a row driver having a reduced leakage current tolower power consumption during a power-savings mode of operation of aflash memory or other type of memory device containing the row driver.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a row driver receivesan input signal and a test mode signal, and is coupled to first andsecond voltage sources and has an output coupled to a word line. The rowdriver operates in an active mode responsive to the test mode signalgoing inactive to couple the output to either the first or secondvoltage source responsive to the input signal. The row driver operatesin a standby mode responsive to the test mode signal going active topresent a high impedance to the word line.

According to another aspect of the present invention, a method ofoperating a memory device includes detecting a first mode of operationof the memory device. The memory device includes a memory-cell arrayhaving a plurality of memory cells arranged in rows and columns, eachmemory cell in a respective row being coupled to an associated wordline. The method further includes floating at least some of the wordlines when the first mode is detected. The memory device may be a flashmemory device and the first mode may be a standby mode of operation ofthe flash memory device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified cross-sectional view of a conventional flashmemory cell.

FIG. 2 is a schematic illustrating a conventional row driver foraccessing data stored in the memory cell of FIG. 1.

FIG. 3 is a simplified cross-sectional view illustrating a gate induceddrain leakage current through the PMOS drive transistor in the rowdriver of FIG. 2.

FIG. 4 is a schematic and block diagram illustrating a row driver havinga reduced gate induced drain leakage current according to one embodimentof the present invention.

FIG. 5 is a functional block diagram illustrating a flash memoryincluding the row driver of FIG. 4.

FIG. 6 is a functional block diagram illustrating a computer systemincluding the flash memory of FIG. 5.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 4 is a schematic and block diagram illustrating a row driver 500including an isolation circuit 502 for reducing a gate induced drainleakage current IGIDL of the row driver during a power-savings mode ofoperation according to one embodiment of the present invention. Theisolation circuit 502 receives a power-savings mode signal PSM, and whenthis signal is active the isolation circuit breaks the current path toground for the IGIDL current and thereby reduces the leakage current ofthe row driver 500 to approximately zero, as will be described in moredetail below. The row driver 500 includes components 504–514 that areconnected and operate in the same way as corresponding components202–212 in the row driver 200 of FIG. 2. For the sake of brevity, thedetailed operation and interconnection of these components 504–514 willnot again be described in detail. In the following description, certaindetails are set forth to provide a sufficient understanding of thepresent invention, but one skilled in the art will appreciate that theinvention may be practiced without these particular details. In otherinstances below, the operation of well known components have not beenshown or described in detail to avoid unnecessarily obscuring thepresent invention.

In the row driver 500, the isolation circuit 502 is coupled to thesource of the NMOS drive transistor 506 and receives the referencevoltage VXGND and the PSM signal, which is generated by circuitry (notshown) in the flash memory containing the row driver 500. The PSM signalindicates whether the flash memory is operating in a normal mode or in apower-savings mode. When the PSM signal is inactive, the flash memory isoperating in the normal mode and the isolation circuit 502 couples thesource of the NMOS drive transistor 506 to the reference voltage VXGND.In the normal mode, the row driver 500 then operates in the same way aspreviously described for the row driver 200 of FIG. 2. Briefly, in thissituation, the row driver 500 couples the word line WL to the supplyvoltage VX through the transistor 504 when the VXDECEN and XPDA signalsare high, and couples the word line to the reference voltage VXGNDthrough the NMOS drive transistor 512 and the isolation circuit 502 whenthe VXDECEN and XPDA signals are low.

When the PSM signal goes active, the flash memory operates in thepower-savings mode and the isolation circuit 502 presents a highimpedance on the source of the NMOS drive transistor 506 to therebyisolate the source from ground. In the power-savings mode, the VXDECEN#and XPDA signals are low, driving the node 514 high through thetransistor 510 and turning the PMOS drive transistor 504 OFF and theNMOS drive transistor 506 ON as previously discussed during the normalmode. In this situation, the current path of the IGIDL current throughthe PMOS drive transistor 504 and the NMOS drive transistor 506 to thereference voltage VXGND is “broken” or “opened” by the high impedancethe isolation circuit 502 presents at the source of the PMOS drivetransistor 506. The high impedance of the isolation circuit 502 therebyisolates or “floats” the source of the NMOS drive transistor 506,preventing the IGIDL current from flowing. In this way, the row driver500 eliminates the IGIDL current normally associated with a row driverduring the power-savings mode of operation. One skilled in the art willunderstand a variety of different circuits that may be utilized to formthe isolation circuit 502, such as a transistor or transmission gate andother suitable circuits.

In the row driver 500, it should be noted that with the row driver 500the word line WL is no longer driven to the reference voltage VXGNDthrough the NMOS drive transistor 506 as in the conventional row driver200 of FIG. 2. In contrast, during the power-savings mode the highimpedance of the isolation circuit 502 results in the word line WL beingisolated from the reference voltage VXGND. With the conventional rowdriver 200, the word line WL was driven to ground to turn OFF all memorycells coupled to the word line. The row driver 500, in contrast, takesadvantage of the fact that during the power-savings mode the word linesWL need not be driven to ground since none of the memory cells are beingaccessed. Moreover, the nonvolatile nature of the storage in the flashmemory cells allows the word lines WL to float since even if one or morerows of memory cells turns ON, the data stored in those cells will notbe lost.

FIG. 5 is a functional block diagram of a flash memory 400 including aplurality of row drivers 500 of FIG. 4. The row drivers are showncontained in address decoders 440 a, 440 b, which will be discussed inmore detail below. The flash memory 400 includes a command state machine(CSM) 404 that receives control signals including a reset/power-downsignal RP#, a chip enable signal CE#, a write enable signal WE#, and anoutput enable signal OE#, where the “#” denotes a signal as being lowtrue. An external processor (not shown) applies command codes on a databus DQ0–DQ15 and these command codes are applied through a data inputbuffer 416 to the CSM 404. A command being applied to the flash memory400 includes the control signals RP#, CE#, WE#, and OE# in combinationwith the command codes applied on the data bus DQ0–DQ15. The CSM 404decodes the commands and acts as an interface between the externalprocessor and an internal write state machine (WSM) 408. When a specificcommand is issued to the CSM 404, internal command signals are providedto the WSM 408, which in turn, executes the appropriate process togenerate the necessary timing signals to control the memory device 400internally and accomplish the requested operation. The CSM 404 alsoprovides the internal command signals to an ID register 408 and a statusregister 410, which allows the progress of various operations to bemonitored when interrogated by issuing to the CSM 404 the appropriatecommand.

In response to the RP# and/or CE# signals, the CSM 404 develops the PSMsignal to control the mode of operation of the row drivers 500. In oneembodiment, when the CE# signal is active low, the CSM 404 deactivatesthe PSM signal, placing the row drivers 500 in the normal mode ofoperation. When the CE# signal is inactive high, the CSM 404 activatesthe PSM signal and thereby places the row drivers 500 in thepower-savings mode of operation.

The CE#, WE#, and OE# signals are also provided to input/output (I/O)logic 412 which, in response to these signals indicating a read or writecommand, enables a data input buffer 416 and an data output buffer 418,respectively. The I/O logic 412 also provides signals to an addressinput buffer 422 in order for address signals to be latched by anaddress latch 424. The latched address signals are in turn provided bythe address latch 424 to an address multiplexer 428 under the command ofthe WSM 406. The address multiplexer 428 selects between the addresssignals provided by the address latch 424 and those provided by anaddress counter 432. The address signals provided by the addressmultiplexer 428 are used by the address decoders 440 a, 440 b to accessthe memory cells of memory banks 444 a, 444 b that correspond to theaddress signals. Based on the decoded address, row activation signalsare provided to the appropriate row drivers 500 to drive the respectiveword line for accessing the memory cells. A gating/sensing circuit 448a, 448 b is coupled to each memory bank 444 a, 444 b for the purpose ofprogramming and erase operations, as well as for read operations. Anautomatic power saving (APS) control circuit 449 receives addresssignals from the address input buffer 422 and also monitors the controlsignals RP#, CE#, OE#, and WE#. When none of these lines toggle within atime-out period, the APS control circuit 449 generates control signalsto place the gating/sensing circuits 448 a, 448 b in a power-saving modeof operation.

During a read operation, data is sensed by the gating/sensing circuit448 a, 448 b and amplified to sufficient voltage levels before beingprovided to an output multiplexer 450. The read operation is completedwhen the WSM 406 instructs an output buffer 418 to latch data providedfrom the output multiplexer 450 to be provided to the externalprocessor. The output multiplexer 450 can also select data from the IDand status registers 408, 410 to be provided to the output buffer 418when instructed to do so by the WSM 406. During a program or eraseoperation, the I/O logic 412 commands the data input buffer 416 toprovide the data signals to a data register 460 to be latched. The WSM406 also issues commands to program/erase circuitry 464 which uses theaddress decoder 440 to carry out the process of injecting or removingelectrons from the memory cells of the memory banks 444 a, 444 b tostore the data provided by the data register 460 to the gating sensingcircuit 448. To ensure that sufficient programming or erasing has beenperformed, a data comparator 470 is instructed by the WSM 406 to compareor verify the state of the programmed or erased memory cells to the datalatched by the data register 460. During all of these modes of operationthe CSM 404 maintains the PSM signal inactive so that the row drivers500 operate in the normal mode as previously described.

The flash memory 400 operates in a standby mode power-savings when theRP# and CE# signals are both high, and operates in a reset deeppower-down mode when the RP# signal goes active low. As previouslymentioned, in one embodiment, in response to the RP# and CE# signalsgoing inactive high to place the memory 400 in the standby mode, the CSM404 drives the PSM signal active, placing the row drivers 500 in thepower-savings mode of operation and thereby reducing the power consumedby the flash memory in the standby mode.

It will be appreciated that the embodiment of the flash memory 400illustrated in FIG. 5 has been provided by way of example and that thepresent invention is not limited thereto. Those of ordinary skill in theart have sufficient understanding to modify the previously describedflash memory embodiment to implement other embodiments of the presentinvention. For example, although the row drivers 500 are shown as beingcontained in the decoders 440 a, 440 b in FIG. 6, the row drivers may beincorporated into one of the other circuit blocks, or alternatively, maybe split among several circuit blocks. The particular arrangement of therow drivers 500 within a memory device will be a matter of designpreference. Moreover, the CSM 404 may also activate the PSM signal inresponse to other operating modes of the flash memory 400, such when theRP# signal goes active low to place the flash memory in the resetdeep-power down mode of operation. The row driver 500 may also be usedin other types of integrated circuits containing flash memory, and alsomay be used in other types of memory where word lines may be floatedduring certain modes of operation to realize power savings during suchmodes of operation.

FIG. 6 is a block diagram of a computer system 600 including computercircuitry 602 that contains the flash memory 400 of FIG. 6. The computercircuitry 602 performs various computing functions, such as executingspecific software to perform specific calculations or tasks. Inaddition, the computer system 600 includes one or more input devices604, such as a keyboard or a mouse, coupled to the computer circuitry602 to allow an operator to interface with the computer system.Typically, the computer system 600 also includes one or more outputdevices 606 coupled to the computer circuitry 602, such output devicestypically being a printer or video display. One or more data storagedevices 608 are also typically coupled to the computer circuitry 602 tostore data or retrieve data from external storage media (not shown).Examples of typical storage devices 608 include hard and floppy disks,tape cassettes, compact disc read-only memories (CD-ROMs), read-write CDROMS (CD-RW), and digital video discs (DVDs). The computer system 610also typically includes communications ports 610 such as a universalserial bus (USB) and/or an IEEE-1394 bus to provide for communicationswith other devices, such as desktop personal computers, a digitalcameras, and digital camcorders. The computer circuitry 602 is typicallycoupled to the flash memory 400 through appropriate address, data, andcontrol busses to provide for writing data to and reading data from theflash memory.

Even though various embodiments and advantages of the present inventionhave been set forth in the foregoing description, the above disclosureis illustrative only, and changes may be made in detail and yet remainwithin the broad aspects of the invention. Therefore, the presentinvention is to be limited only by the appended claims.

1. A row driver comprising a circuit adapted to receive an input signaland a test mode signal, and adapted to be coupled to first and secondvoltage sources and having an output adapted to be coupled to a wordline, the circuit operable in an active mode responsive to the test modesignal going inactive to couple the output to either the first or secondvoltage source responsive to the input signal, and being operable in astandby mode responsive to the test mode signal going active to presenta high impedance to the word line.
 2. The row driver of claim 1 whereinthe first voltage source comprises a supply voltage source and thesecond voltage source comprises a reference voltage source.
 3. The rowdriver of claim 1 wherein the test mode signal goes active during astandby mode of operation and goes inactive during a normal operatingmode during which memory cells coupled to the word line may be accessed.4. The row driver of claim 1 further comprising: a first output circuithaving a first terminal adapted to receive a supply voltage, a secondterminal coupled to an output node, and a control terminal adapted toreceive an input signal, the first output circuit being operable tocouple the first terminal to the second terminal responsive to the inputsignal having a first logic state, and operable to isolate the first andsecond terminals responsive to the input signal having a second logicstate; a second output circuit having a first terminal, a secondterminal coupled to the output node, and a control terminal adapted toreceive the input signal, the second output circuit being operable tocouple the first terminal to the second terminals responsive to theinput signal having the second logic state, and operable to isolate thefirst and second terminals responsive to the input signal having thefirst logic state; and an isolation circuit adapted to receive areference voltage and coupled to the first terminal of the second outputcircuit, and adapted to receive a test mode signal, the isolationcircuit operable responsive to the test mode signal being inactive toapply the reference voltage on the first terminal of the second outputcircuit, and operable responsive to the test mode signal being active topresent a high impedance to the first terminal of the second outputcircuit.
 5. The row driver of claim 4 wherein the first output circuitcomprises a PMOS transistor and the second output circuit comprises anNMOS transistor.
 6. The row driver of claim 4 wherein the isolationcircuit comprises a transistor.
 7. A row driver, comprising: a PMOStransistor having a source adapted to receive a supply voltage, a gateadapted to receive an input signal, and a drain adapted to be coupled toa word line; an NMOS transistor having a drain coupled to the drain ofthe PMOS transistor, a source, and a gate coupled to the gate of thePMOS transistor; an isolation circuit coupled to the source of the NMOStransistor and adapted to receive a reference voltage and a test modesignal, the isolation circuit coupling the source of the NMOS transistorto the reference voltage responsive to the test mode signal goinginactive and presenting a high impedance at the source of the NMOStransistor responsive to the test mode signal going active.
 8. The rowdriver of claim 7 wherein the test mode signal goes active during astandby mode of operation and goes inactive during a normal operatingmode during which memory cells coupled to the word line may be accessed.9. The row driver of claim 7 wherein the reference voltage comprisesground.
 10. The row driver of claim 7 wherein the isolation circuitcomprises a transistor.
 11. A row driver including a PMOS transistorcoupled between a supply voltage source and an output node, andincluding an NMOS transistor coupled between the output node and areference node, the gates of the transistors being adapted to receive aninput signal and the output node being coupled to a word line, and therow driver including an isolation circuit coupled to the reference nodeand adapted to receive a test mode signal and a reference voltage, theisolation circuit operable in a first mode responsive to the test modesignal going inactive to apply the reference voltage on the referencenode and the PMOS and NMOS transistors being operable during the firstmode to couple the word line to either the supply voltage or thereference voltage in response to the input signal, and the isolationcircuit operable in a second mode responsive to the test mode signalgoing active to isolate the reference node, the PMOS transistor beingdeactivated during the second mode and the NMOS transistor beingactivated to couple the word line to the isolated reference node, theisolated reference node reducing any gate induced leakage currentthrough the PMOS transistor during the second mode.
 12. The row driverof claim 11 wherein the test mode signal goes active during a standbymode of operation and goes inactive during a normal operating modeduring which memory cells coupled to the word line may be accessed. 13.The row driver of claim 11 wherein the reference voltage comprisesground.
 14. A row driver, comprising: a first coupling means having afirst terminal adapted to receive a supply voltage, a second terminalcoupled to an output node adapted to be coupled to a word line, and acontrol terminal adapted to receive an input signal for coupling orisolating the first and second terminals responsive to the input signal;a second coupling means having a first terminal, a second terminalcoupled to the output node, and a control terminal adapted to receivethe input signal for coupling or isolating the first and second signalterminals responsive to the input signal; and an isolation means adaptedto receive the reference voltage and coupled to the first terminal ofthe second coupling means, and adapted to receive a test mode signal forapplying the reference voltage on the first terminal of the secondcoupling means when the test mode signal goes inactive and forpresenting a high impedance on the first terminal of the second couplingmeans when the test mode signal goes active.
 15. The row driver of claim14 wherein the test mode signal goes active during a standby mode andgoes inactive during a normal operating mode during which memory cellscoupled to the word line may be accessed.
 16. The row driver of claim 14wherein the reference voltage comprises ground voltage.
 17. A memorydevice, comprising: an address bus; a control bus; a data bus; anaddress decoder coupled to the address bus; a read/write circuit coupledto the data bus; a control circuit coupled to the control bus; amemory-cell array coupled to the address decoder, control circuit, andread/write circuit; the memory-cell array including a plurality of wordlines; and a plurality of row drivers, each row driver coupled to anassociated word line in the memory-cell array and coupled to the addressdecoder to receive a row activation signal, and the row driver beingcoupled to the control circuit to receive a test mode signal, each rowdriver being operable in an active mode responsive to the test modesignal going inactive to couple the associated word line to either afirst or a second voltage source responsive to the corresponding rowactivation signal, and being operable in a standby mode responsive tothe test mode signal going active to present a high impedance to thecorresponding word line.
 18. The memory device of claim 17 wherein thefirst voltage source comprises a supply voltage source and the secondvoltage source comprises a reference voltage source.
 19. The memorydevice of claim 17 wherein the memory device comprises a flash memoryand wherein the test mode signal goes active during a standby mode ofoperation and goes inactive during a normal operating mode during whichmemory cells coupled to an addressed word line may be accessed.
 20. Acomputer system, comprising: a data input device; a data output device;a processor coupled to the data input and output devices; and a memorydevice coupled to the processor, the memory device comprising, anaddress bus; a control bus; a data bus; an address decoder coupled tothe address bus; a read/write circuit coupled to the data bus; a controlcircuit coupled to the control bus; a memory-cell array coupled to theaddress decoder, control circuit, and read/write circuit; thememory-cell array including a plurality of word lines; and a pluralityof row drivers, each row driver coupled to an associated word line inthe memory-cell array and coupled to the address decoder to receive arow activation signal, and the row driver being coupled to the controlcircuit to receive a test mode signal, each row driver being operable inan active mode responsive to the test mode signal going inactive tocouple the associated word line to either a first or a second voltagesource responsive to the corresponding row activation signal, and beingoperable in a standby mode responsive to the test mode signal goingactive to present a high impedance to the corresponding word line. 21.The computer system of claim 20 wherein the first voltage sourcecomprises a supply voltage source and the second voltage sourcecomprises a reference voltage source.
 22. The computer system of claim20 wherein the memory device comprises a flash memory and wherein thetest mode signal goes active during a standby mode of operation and goesinactive during a normal operating mode during which memory cellscoupled to an addressed word line may be accessed.